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AI predicts companies likely to trade related products within 1-2 months, with up to 92% accuracy.
Learn moremalaysia|9392 transactions
Active Value 77
Trading: TIN SOLDER PASTE - SHF M705-S101ZH-S4 (POWDER FOR SOLDERING TIN - CMAS101ZHS4/05V SHF M705-S101ZH-S4 500G ECO SOLDER PASTE). NEW 100%.
singapore|2525 transactions
Active Value 76
Trading: SO-PA-37# & TIN SOLDER PASTE USED IN ELECTRONIC CIRCUIT BOARD PRODUCTION LINE, TYPE SAC305 INDIUM10.8HF TYPE4.5 89%, 500 GRAMS/VIAL, INDIUM BRAND, 100% NEW
south korea|1826 transactions
Active Value 86
Trading: PWM118# & TIN SOLDER PASTE IS USED TO CONNECT COMPONENTS TO THE SOLDER PASTE ELECTRONIC CIRCUIT BOARD, COMPONENT: SN / 3.0AG / 0.5CU T4. NEW 100%
malaysia|3835 transactions
Active Value 76
Trading: TIN SOLDER PASTE (SOLDER PASTE) ECO SOLDER PASTE SHF M705-S101ZH-S4 (100% BRAND NEW)
thailand|1107 transactions
Active Value 76
Trading: SOLDER PASTE#&LEAD-FREE TIN SOLDER PASTE USED IN THE PRODUCTION OF ELECTRONIC CIRCUIT BOARDS, 100% BRAND NEW. (PN: DGNSPEPF606P00HF)
China Taiwan|1186 transactions
Active Value 76
Trading: LEAD-FREE TIN SOLDER PASTE, SPECIFICATION: 500G/BOTTLE, 100% NEW. SKU: PF606-PW005-T4,500G/JAR
south korea|978 transactions
Active Value 75
Trading: SOLDER016#&9YCLL-0004A - TIN SOLDER PASTE, PASTE (CONTAINS TIN METAL POWDER, ROSIN AND ADDITIVES) SOLDER CREAM ** HEE LFM 48W NH(M), 100% NEW
japan|2391 transactions
Active Value 76
Trading: 324452010009# & TIN SOLDER PASTE (USED TO SOLDER COMPONENTS ONTO THE PCM BOARD OF THE BATTERY) (MODEL: S3X48-M500, NET WEIGHT: 500G/1 BOTTLE, MANUFACTURER: KOKI). NEW 100%
japan|503 transactions
Active Value 75
Trading: 38.02358.007#&Preparation for soldering tin (solder paste) S3X58-HF1100-3, 500G/bottle (Ingredients: Tin 82-88%, silver 2-3%, copper 0.1-1%,..), 100% new. Code 38.02358.007
singapore|2229 transactions
Active Value 76
Trading: TIN SOLDER PASTE, BRAND NAME M705-SHF-T6K, INGREDIENTS: TIN, SLIVER,COPPER...,(0.5 KG/BOTTLE), USED TO CONNECT COMPONENTS WITH ELECTRONIC CIRCUIT BOARDS. NEW 100%
malaysia|2532 transactions
Active Value 76
Trading: TIN SOLDER PASTE - NP303-COSMO-ZQ-C (SOLDER PASTE-SSSB CLEAN S/CREAM NP303-COSMO-ZQ-C IN 500GRM CONT). NEW 100%.
china|374 transactions
Active Value 75
Trading: TIN BASED SOLDER POWDER SNBI57.6AG0.4 T3, USED TO PRODUCE TIN SOLDER PASTE. 100% NEW
china|704 transactions
Active Value 75
Trading: 76# & TIN SOLDER PASTE#(292-93312AV). NEW 100%
japan|509 transactions
Active Value 75
Trading: TIN SOLDER PASTE LFM-48X TM 11.5%. NEW 100%
china|205 transactions
Active Value 75
Trading: APS049# & TIN SOLDER PASTE M705-GRN360-K2-V, 100% BRAND NEW
vietnam|328 transactions
Active Value 75
Trading: CREAM SOLDERING TIN, SOLDER PASTE TLF-204-27F4-R, MATERIAL CODE 04-012006-01, FOR SOLDERING TIN, 500G/BOX, NSX: SHANGHAI XIANGLE TAMURAELECTRO CHEMICAL INDUSTRY CO.,LTD., 57KG =57000G, NEW 100%#&CN
south korea|1089 transactions
Active Value 86
Trading: TIN SOLDER PASTE, BRAND NAME M705-SHF-T6K, INGREDIENTS: TIN, SLIVER,COPPER...,(0.5 KG/BOTTLE), USED TO CONNECT COMPONENTS WITH ELECTRONIC CIRCUIT BOARDS. NEW 100%
japan|125 transactions
Active Value 72
Trading: 38.02MA3.031#&PREPARATION FOR SOLDERING TIN (SOLDER PASTE) S3X58-M406, 500G/BOTTLE (TP: 82-88% TIN, 2-3% SILVER,..), USED TO CONNECT COMPONENTS WITH CIRCUIT BOARDS ELECTRONIC, NSX KOKI, 100% NEW, CODE 38.02MA3.031
china|201 transactions
Active Value 75
Trading: TIN SOLDER PASTE - SOLDER PASTE, SN42BI57.6AG0.4, PASTE PREPARATION (CONTAINS METAL POWDER SN, BI, AG AND ADDITIVES), 100% BRAND NEW
china|157 transactions
Active Value 72
Trading: SCFL-DDXG-JGP_1000 Tin/Solder Paste 30g/10cc(JGP-1000)AS INV SCFL-DDXG-JGP_1000 Tin/Solder Paste 30g/10cc(JGP-1000)AS INV
south korea|3148 transactions
Active Value 86
Trading: SOLDER PASTE TIN SOLDER PASTE, BRAND M705-SHF, INGREDIENTS: SN, AG, CU ... (0.5 KG/VIAL), USED TO CONNECT COMPONENTS WITH ELECTRONIC CIRCUIT BOARDS, 100% BRAND NEW
vietnam|2082 transactions
Active Value 76
Trading: SAC305 ABL-A6NH-5 SOLDER PASTE, TIN SOLDER PASTE. 100% BRAND NEW#&VN
korea|36 transactions
Active Value 72
Trading: TIN SOLDER PASTE, BRAND LFM-48W, COMPOSITION 96.5 SN - 3.0 AG - 0.5 CU . NEW 100%
china|1588 transactions
Active Value 76
Trading: Kem thiếc hàn,dùng hàn gắn các bo mạch điện tử trong công nghiệp(Tin Solder Paste),hiệu YUNTINIC, type SnAg3.0Cu0.5, tp chính:thiếc,bạc,đồng,dạng bột nhão.500g/hộp.CAS 7440-31-5,7440-22-4,mới100%
singapore|171 transactions
Active Value 72
Trading: M705-515A(8)C1-T7G#&TIN SOLDER PASTE, BRAND NAME M705-515A(8)C1-T7G, COMPOSITION: SN,AG,CU...,(0.5 KG/BOTTLE), USED FOR CONNECTING FLEXIBLE WITH THE ELECTRONIC CIRCUIT BOARD. NEW 100%
vietnam|3205 transactions
Active Value 76
Trading: TIN SOLDER PASTE (TPL PASTE TLSE07-4) IS RECOVERED FROM THE SOLDERING PROCESS OF THE CIRCUIT BOARD
vietnam|2570 transactions
Active Value 76
Trading: WMP-S00018LF2#&TIN SOLDER PASTE, USED TO SOLDER ON ELECTRONIC CIRCUIT BOARDS, 500G/BOTTLE, 100% NEW PRODUCT, WMP-S00018LF2
vietnam|1121 transactions
Active Value 76
Trading: PH55ZXX# & TIN SOLDER PASTE TF232-M305NI-C-890, TP (SOLDER ALLOY: SN, CU, AG; PASTE FLUX: POLYMERIZED ROSIN, MODIFIED ROSIN, PGME, HCO), USED FOR SOLDERING CIRCUIT BOARD COMPONENTS (SAP CODE: 55Z03000003-H00).100% BRAND NEW
china|1033 transactions
Active Value 76
Trading: PLASTIC CAP OF PLASTIC JAR OF TIN SOLDER PASTE, SIZE 63MM, 100% NEW
china|1154 transactions
Active Value 76
Trading: 890201-000003#&LEAD-FREE TIN SOLDER PASTE (POWDER) GP-211-171AK, USED FOR SOLDERING MACHINES TO SOLDER ELECTRONIC COMPONENTS ON CIRCUIT BOARDS, P/N. 890201-000003, 100% NEW
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